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Development of High-Reliability PCB Solutions for Subsea Oil & Gas Applications

intechhouse.com

Energy & natural resources

Manufacturing

Information technology

Challenges in Subsea PCB Development

Need for specialized PCB solutions that can withstand subsea environments for decades while meeting IPC Class 3 standards. Challenges include unusual PCB parameters (stack up, thickness, surface finish), limited qualified subcontractors, and complex global design requirements across multiple geographic locations.

About the Client

Multinational energy corporation with European headquarters requiring specialized electronic hardware for extreme environments

Key Development Goals

Create IPC Class 3 compliant PCBs for subsea applications
Develop reliable PCB solutions for extreme environmental conditions
Optimize design for space constraints and electrical noise reduction
Establish effective collaboration between engineering and manufacturing teams
Reduce long-term manufacturing costs through standardized PCB solutions

Core System Requirements

IPC Class 3 standard compliance for prototype manufacturing
Custom stack-up and surface finish specifications
Industrial-grade component selection for extreme temperatures
Noise-reduction trace routing and component placement
Validation testing for 30+ year operational lifespan

Design & Simulation Tools

Altium Designer

LTspice

Critical Performance Criteria

Environmental durability for subsea conditions
Scalable manufacturing processes for cost efficiency
Mechanical strength for long-term reliability
Electromagnetic interference (EMI) reduction
Traceability for regulatory compliance

Expected Business Outcomes

Enables reliable subsea operations with reduced maintenance costs, improves product longevity through industrial-grade components, and establishes standardized PCB solutions for global deployment. Expected to reduce manufacturing costs by 25% while maintaining IPC Class 3 compliance in small-batch production.